automotriz

La electrónica juega un papel integral en los automóviles contemporáneos, con más de 50 funciones y opciones en cada vehículo que suelen controlarse electrónicamente. Los fabricantes de automóviles se enfrentan a nuevos desafíos en este sentido, que van desde el montaje de lámparas LED de precisión y la manipulación de pequeños sustratos hasta el montaje de tecnología de conversión de energía destinada a la aparición del sector de automóviles eléctricos. Estos productos también están estrictamente regulados y requieren procesos rigurosos para garantizar la calidad y proteger a los consumidores.

Universal tiene la experiencia en el sector automotriz y las soluciones de equipamiento para enfrentar sus desafíos con la tranquilidad de saber que su marca, y los conductores de todo el mundo, están seguros. Nuestra cartera de tecnologías incluye soluciones de SMT de alto rendimiento y soluciones avanzadas de embalaje, formas irregulares y automatización precisa para satisfacer los requisitos multitecnológicos del mercado. También integraremos equipos de terceros sin problemas para crear una solución para un solo proveedor que permita construir el automóvil del futuro en la actualidad a quienes aspiran a hacerlo.

ADAS Y SEGURIDAD

  • Lidar
  • Radar
  • Cámaras
  • Sensores

NUEVOS VEHÍCULOS ELÉCTRICOS

  • Módulos controlados por batería
  • Inversor de voltaje con IGBT
  • Módulos de carga integrados

TREN MOTRIZ

  • Módulos de relés de control electrónico para motores, encendido, transmisión y refrigeración

CHASIS E INTERIOR

  • Pantallas
  • Iluminación
  • Sensores

ILUMINACIÓN

  • Faro LED de alta precisión

¿TIENE GANAS DE CREAR ALGO MEJOR?

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APLICACIONES PARA EL MERCADO AUTOMOTRIZ

 

Server/Network
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
Prototyping, first article build, volume production
Design for Manufacture (DfM) and Design for Reliability (DfR)
IPC Certified Testing Lab
FDA registered manufacturing facility
ITAR Compliant facility
Mobility & Wearables
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
Prototyping, first article build, volume production
Design for Manufacture (DfM) and Design for Reliability (DfR)
IPC Certified Testing Lab
FDA registered manufacturing facility
ITAR Compliant facility
Automotive
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
Prototyping, first article build, volume production
Design for Manufacture (DfM) and Design for Reliability (DfR)
IPC Certified Testing Lab
FDA registered manufacturing facility
ITAR Compliant facility
Medical
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
Prototyping, first article build, volume production
Design for Manufacture (DfM) and Design for Reliability (DfR)
IPC Certified Testing Lab
FDA registered manufacturing facility
ITAR Compliant facility
Mil/Aero
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
Prototyping, first article build, volume production
Design for Manufacture (DfM) and Design for Reliability (DfR)
IPC Certified Testing Lab
FDA registered manufacturing facility
ITAR Compliant facility
Industrial/IOT
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
Prototyping, first article build, volume production
Design for Manufacture (DfM) and Design for Reliability (DfR)
IPC Certified Testing Lab
FDA registered manufacturing facility
ITAR Compliant facility
Smart Agriculture
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
Prototyping, first article build, volume production
Design for Manufacture (DfM) and Design for Reliability (DfR)
IPC Certified Testing Lab
FDA registered manufacturing facility
ITAR Compliant facility
Renewable Energy
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
Prototyping, first article build, volume production
Design for Manufacture (DfM) and Design for Reliability (DfR)
IPC Certified Testing Lab
FDA registered manufacturing facility
ITAR Compliant facility

VIDEOS SOBRE LA APLICACIÓN

ENSAMBLAJE DE AUTOMÓVILES