Industrial/iot
La electrónica industrial abarca una amplia gama de productos y los fabricantes se esfuerzan por producir bienes de alta calidad que los sitúen por delante de la competencia. La producción de estos productos puede implicar la manipulación de grandes sustratos con zonas de colocación de montaje superficial concentradas en circuitos pequeños, pero también puede requerir la colocación de LED para pantallas de control o tecnologías de componentes de orificio pasante más tradicionales para productos como los electrodomésticos.
Universal ayuda a los fabricantes de electrónica industrial a crear un entorno completo de soluciones, proporcionándoles la flexibilidad necesaria para asumir los desafíos de esta variada combinación de productos. Con un catálogo de productos de tecnología de orificio pasante que es el estándar perdurable de la industria y un catálogo de productos de montaje superficial que es el mejor de su clase y que se adapta a cualquier combinación o volumen, Universal se encuentra en una posición única para maximizar la productividad, minimizar el tiempo de comercialización y fabricar y controlar mejor los productos cotidianos.
ELECTRODOMÉSTICOS
- Lidar
- Radar
- Cámaras
- Sensores
MEDIDORES Y CONTROLES
- Controladores de temperatura (freidoras, congeladores, etc.)
- Medidores de agua y electricidad
INSTRUMENTAL
- Atomatización
- Flujo
- Análisis de gases
- Instrumentos de nivelación
- Análisis de líquidos
- Presión
- Temperatura
ADMINISTRACIÓN DE ENERGÍA
- Inversor de voltaje con IGBT
¿TIENE GANAS DE CREAR ALGO MEJOR?
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APLICACIONES PARA EL MERCADO INDUSTRIAL/IOT
RECURSOS
Server/Network
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
⬤
High-part count die on wafer CoWoS
⬤
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
⬤
DIMM memory module automation
⬤
Large PCB server board SMT assembly
⬤
SSD e-cap form/cut & insert
⬤
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
⬤
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Mobility & Wearables
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
⬤
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
⬤
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Automotive
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
⬤
High-part count die on wafer CoWoS
⬤
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
⬤
Die on Flex
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
⬤
High-Accuracy LED placement (TAP)
⬤
LIDAR & MEMs module assembly
⬤
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Medical
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
⬤
ITAR Compliant facility
Mil/Aero
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
High-part count die on wafer CoWoS
⬤
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
⬤
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
⬤
Industrial/IOT
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
⬤
Die on Flex
⬤
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
⬤
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Smart Agriculture
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
Hot bar bonding
⬤
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
⬤
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Renewable Energy
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
⬤
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤