AGRICULTURA INTELIGENTE
La electrónica ha mejorado la vida de muchas personas en muchos aspectos, y la agricultura no es la excepción. La producción agrícola, tanto vegetal como animal, se ha visto mejorada gracias a tecnologías de potenciación como sensores, visión artificial, robótica, redes e incluso inteligencia artificial. Estos avances permiten que los entornos agrícolas recopilen, procesen y reaccionen según la información disponible, lo que permite una mayor capacidad de cultivo y cosecha de plantas, alimentos más frescos y mucho más.
Universal ayudó a muchos de sus clientes a dar el siguiente paso con respecto al ensamblaje de productos electrónicos inteligentes, proporcionándoles los mejores equipos de su clase e implementando procesos eficaces y recurrentes. En el ámbito de la agricultura, los sensores y la iluminación LED desempeñan un papel fundamental y Universal se ha asociado con éxito a empresas para elaborar estos productos en una amplia gama de mercados. Nuestras plataformas pueden satisfacer los requisitos de embalaje avanzado más exigentes para sensores, incluidas las aplicaciones de sustratos pequeños y flexibles, y al mismo tiempo manejar placas más grandes para la iluminación LED. Estas capacidades proporcionan una verdadera ventaja competitiva y permiten a nuestras empresas agrícolas crecer de forma más inteligente.
ILUMINACIÓN
- Luces para cultivo LED de techo
Dispositivos de monitorización
- Etiquetas de RFID (Identificación por radio frecuencia)
EQUIPOS INTELIGENTES
- Dispositivos de IoT conectados (controles para invernaderos, etc.)
¿TIENE GANAS DE CREAR ALGO MEJOR?
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APLICACIONES PARA EL MERCADO DE AGRICULTURA
RECURSOS
Server/Network
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
⬤
High-part count die on wafer CoWoS
⬤
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
⬤
DIMM memory module automation
⬤
Large PCB server board SMT assembly
⬤
SSD e-cap form/cut & insert
⬤
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
⬤
Die on Flex
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Mobility & Wearables
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
⬤
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
Embedded die
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
⬤
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Automotive
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
⬤
High-part count die on wafer CoWoS
⬤
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
⬤
Die on Flex
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
⬤
High-Accuracy LED placement (TAP)
⬤
LIDAR & MEMs module assembly
⬤
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Medical
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
⬤
ITAR Compliant facility
Mil/Aero
High-part count die-to-substrate flip chip
⬤
High-part count die on PoP
High-part count die on wafer CoWoS
⬤
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
⬤
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
⬤
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
⬤
Industrial/IOT
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
⬤
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
⬤
Die on Flex
⬤
Embedded die
⬤
Hot bar bonding
⬤
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
⬤
Multi-die flip chip
⬤
IGBT die on substrate assembly
⬤
IGBT module assembly
⬤
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
⬤
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Smart Agriculture
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
Hot bar bonding
⬤
Selective laser soldering
Panel Module Assembly
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
⬤
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
⬤
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤
FDA registered manufacturing facility
ITAR Compliant facility
Renewable Energy
High-part count die-to-substrate flip chip
High-part count die on PoP
High-part count die on wafer CoWoS
Odd-form Pin-through-hole assembly
High-density press-fit connector automation
DIMM memory module automation
Large PCB server board SMT assembly
SSD e-cap form/cut & insert
Multifunction SMT (interposers, antennae, shields)
Semiconductor Heterogeneous Integration
⬤
FO-WLP, FOWLP
Die on Flex
⬤
Embedded die
Hot bar bonding
Selective laser soldering
Panel Module Assembly
⬤
PCB High-Changeover SMT & NPI
Multi-die flip chip
IGBT die on substrate assembly
IGBT module assembly
MEMS sensor module assembly
Flex-flex or flex to PCB attach
High-Speed SMT LED placement
High-Accuracy LED placement (TAP)
LIDAR & MEMs module assembly
Process Development/NPI
⬤
Prototyping, first article build, volume production
⬤
Design for Manufacture (DfM) and Design for Reliability (DfR)
⬤
IPC Certified Testing Lab
⬤